Hong Kong, China
The International Conference on Materials Engineering and Composite Materials (ICMECM2017), sponsored by BOSI EDU, is being organized and will be held on July 22-23, 2017 in Hong Kong, China.
The aim of ICMECM2017 is to gather professors, researchers and scholars all over the world. ICMECM2017 will provide leading academy and industry scientists a platform to communicate recent advances in Advanced Materials Science, Engineering Materials Research and an opportunity to establish multilateral collaborations.
The Paper Publication
The conference proceedings will be published by the journal of "Materials Science Forum"[ISSN print 0255-5476 ISSN cd 1662-9760 ISSN web 1662-9752, Trans Tech Publications]. The papers will be submitted to ISTP (CPCI-S), Google Scholar, CAS, Compendex, Inspec, DOAJ and Scopus.
T1: Advanced Materials Science
T2: Engineering Materials Research
T3: Materials Processing Technology
T4: Materials Related Issue
Submission (Full Paper): May 8, 2017
Notification of Acceptance: May 15, 2017
Authors’ Registration & Payment Deadline: May 22, 2017
Conference Date: July 22-23, 2017